Laser Surface Modification Equipment

特點: Laser Source Options– ns / ps / fs pulse lasers (optional); Process Capability– Laser surface modification– Enhance brittle fracture & smooth grinding / polishing– Achieve ultra-low surface roughness (Ra < few nm); System Performance– High precision XY stage, ±1 μm accuracy– Wafer size support: 4" / 6" / 8" (option for 12")– Real-time monitoring with HR camera; Machine information– Cassette-to-cassette automation with robot loader– Integrated grinding/polishing module (optional); Key Benefits– Reduce chipping and improve yield– High material removal efficiency– Suitable for hard & brittle wafers (SiC, diamond, sapphire, etc.)

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