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Laser surface modification
Laser Surface Modification Equipment
Laser Surface Modification Equipment- Features
- Laser Source Options – ns / ps / fs pulse lasers (optional)
- Process Capability – Laser surface modification – Enhance brittle fracture & smooth grinding / polishing – Achieve ultra-low surface roughness (Ra < few nm)
- System Performance – High precision XY stage, ±1 μm accuracy – Wafer size support: 4" / 6" / 8" (option for 12") – Real-time monitoring with HR camera
- Machine information – Cassette-to-cassette automation with robot loader – Integrated grinding/polishing module (optional)
- Key Benefits – Reduce chipping and improve yield – High material removal efficiency – Suitable for hard & brittle wafers (SiC, diamond, sapphire, etc.)