Precision Laser Micro-Machining System

特點: Ultrafast fs Laser– <300 fs pulse, multi-wavelength selectable (1030 / 515 / 343 nm); High Precision 5-Axis Scanner – ±1 μm accuracy, 3D profile shaping; Fine Beam Control– Spot size 6–25 μm, min. feature ~10 μm; Advanced Workpiece Handling– Supports thin films ≤ 50 μm– Vacuum chuck + cooling stage (0 ~ –20 °C); Process Flexibility; – Supports thin films ≤ 50 μm.; Gas Curtain System– Laminar N₂ flow design; Superior Machining Quality– Taper ~ 0°, corner radius ≤4 μm; Automation Ready– CAD/CAM path import, robot loader, full safety enclosure

Si₃N₄ ceramic plate thickness 300 μm
hole diameter 30 μm
no taper angle.

Si₃N₄ ceramic plate thickness 240 μm
square holes 30 x 30 μm
no taper angle.

Metal probe
dimensions:
50 μm × 50 μm × 5 mm,
minimum feature width 20 μm.

Micro brass gear
thickness: 200 μm, diameter: 5 mm

加入詢問車 (0)