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Laser micro machining
Precision Laser Micro-Machining System
Precision Laser Micro-Machining System- Features
- Ultrafast fs Laser – <300 fs pulse, multi-wavelength selectable (1030 / 515 / 343 nm)
- High Precision 5-Axis Scanner – ±1 μm accuracy, 3D profile shaping
- Fine Beam Control – Spot size 6–25 μm, min. feature ~10 μm
- Advanced Workpiece Handling – Supports thin films ≤ 50 μm – Vacuum chuck + cooling stage (0 ~ –20 °C)
- Process Flexibility
- – Supports thin films ≤ 50 μm.
- Gas Curtain System – Laminar N₂ flow design
- Superior Machining Quality – Taper ~ 0°, corner radius ≤4 μm
- Automation Ready – CAD/CAM path import, robot loader, full safety enclosure
Description
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Si₃N₄ ceramic plate thickness 300 μm
hole diameter 30 μm
no taper angle.
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Si₃N₄ ceramic plate thickness 240 μm
square holes 30 x 30 μm
no taper angle.
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Metal probe
dimensions:
50 μm × 50 μm × 5 mm,
minimum feature width 20 μm.
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Micro brass gear
thickness: 200 μm, diameter: 5 mm