產品介紹
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- 產品介紹
- Semi Advance Package
- Wafer level
- Wafer to Wafer Bonder
Wafer level
Wafer to Wafer Bonder
hMCB-series- 特點
- Wafer size: 6’’~12‘’
- Wafer thickness.: 0.3mm to 3mm
- Accuracy: +/-3 um
- Pre-bonding monitor: load cell for 3 points monitor
- In-situ monitor: surface load cell monitor