設備1-黑底
Wafer to wafer bonder 圖1-1
設備1-黑底
Wafer to wafer bonder 圖1-1

Wafer level

Wafer to Wafer Bonder

hMCB-series
Features
Wafer size: 6’’~12‘’
Wafer thickness.: 0.3mm to 3mm
Accuracy: +/-3 um
Pre-bonding monitor: load cell for 3 points monitor
In-situ monitor: surface load cell monitor
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