產品介紹
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- 產品介紹
- Semi Advance Package
- Die level ( TCB/LAB )
- Fully Automatic TCB\LAB Bonder
Die level ( TCB/LAB )
Fully Automatic TCB\LAB Bonder
DuaPro-series- 特點
- Dedicated for FC, C2S, C2W, advanced packaging
- High accuracy ±1um
- UPH up to 1,000 (TCB mode )
- UPH up to 3,500 (MR mode)
- Automatic bonding tool LD/UD
- head optional for thermal / laser assisted
介紹
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