001 (1)
tcb圖
001 (1)
tcb圖

Die level ( TCB/LAB )

Fully Automatic TCB\LAB Bonder

DuaPro-series
Features
Dedicated for FC, C2S, C2W, advanced packaging
High accuracy ±1um
UPH up to 1,000 (TCB mode )
UPH up to 3,500 (MR mode)
Automatic bonding tool LD/UD
Head optional for thermal / laser assisted

Description

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