Laser Assisted Die Bonding

NCB-series

Features: Carrier to substrate (Die bonding); World's first exclusive patented design:; transferring LED from the blue tape to the substrate, then process laser welding.; Offers exceptionally high rework efficiency and yield, and capable of after molding rework for products.

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Item	Specification
Capacity	6s/die (repair mode) 4s/die (debond mode)
Accuracy	± 10 µm
Minimum chip size	< 15 x 30 µm
Support multi-functions switch:	(a) Debond (b) Repair (c) Solder dispensing/dipping (optional)