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MiniLED solutions
Massive Laser Bonding
MCB-series- Features
- Carrier transfer to substrate (Massive soldering)
- Exclusive patented laser welding machine, offering the largest single-weld transfer area available on the market.
| Item | Specification |
|---|---|
| Capacity | + 200K/hr @ P0.5mm |
| Accuracy | ± 10um |
| Minimum chip size | 0204 mil |
| Carrier size | 200*200mm |