Wafer Slicing Equipment

Features: Laser Source Options– ns / ps / fs pulse laser (optional); High-Precision Platform– Advanced X-Y moving stage, micron-level positioning accuracy– Stable, rigid structure for vibration-free operation; High-Efficiency Modifying Module– Optimized for sapphire, diamond, and compound semiconductors– Enhanced slicing performance with minimal chipping; Fully Automated Handling– Supports 4" / 6" / 8" wafers (option for 12"); Key Benefits– Reduced wafer slicing time– Superior cut quality with minimal surface damage– High throughput with automated handling

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