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- Semi Advance Package
- Wafer level
- W2W/D2W Hybrid Bonder
Wafer level
W2W/D2W Hybrid Bonder
Aion -series- Features
- Dedicated for C2W, C2W hybrid bonding
- High accuracy: C2W ±500nm / W2W±200 nm
- C2W \ W2W bonding for 8” or 12”
- Automatic bonding tool LD/UD